Methods and apparatus for achieving thermal management using processor manipulation

ABSTRACT

The present invention provides apparatus and methods to perform thermal management in a computing environment. Thermal attributes are associated with operations and/or processing components. The components have thermal thresholds that should not be exceeded. In a preferred embodiment, an operation can be transferred from one component to another component if the thermal threshold is exceeded during execution by the first component.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to commonly assigned U.S. patent application Ser. No. 10/812,177, entitled “Methods and Apparatus for Achieving Thermal Management Using Processing Task Scheduling,” filed Mar. 29, 2004, and incorporated by reference herein.

BACKGROUND OF THE INVENTION

The present invention relates to methods and apparatus for performing thermal management in a processing environment, and, in particular, for reducing thermal hot spots by effectively allocating instructions and tasks.

Computing systems are becoming increasingly more complex, achieving higher processing speeds while at the same time shrinking component size and densely packing devices on a computer chip. Such advances are critical to the success of many applications, such as real-time, multimedia gaming and other computation-intensive applications. Often, computing systems incorporate multiple processors that operate in parallel (or at least in concert) to increase processing efficiency.

Heat is often generated as components and devices perform operations such as instructions and tasks. Excessive heat can adversely impact the processing capability of an electronic component such as a computer chip. For example, if one area of the chip is performing computationally intensive tasks, that area can heat up significantly and form a hot spot relative to the rest of the chip. If the hot spot exceeds a thermal threshold, the performance of the components or devices in that area of the chip may be degraded, or the chip may even become damaged or destroyed.

In the past, a variety of solutions have been employed to solve the overheating problem. A mechanical solution is to attach a heat sink to the computer chip. However, heat sinks are bulky and may merely serve to expel heat from the chip and into the volume of space surrounding the chip. When the chip is stored in an enclosure, such as personal computer cabinet, this heat must be removed such as by the use of fans, which themselves take up space and generate unwanted noise.

Other, more complex heat management schemes also exist. For instance, in one solution, temperature sensors can be placed on critical circuit elements, such as the processor, and fans can be mounted in an associated system enclosure. When the temperature sensors indicate a particular temperature has been reached, the fans turn on, increasing the airflow through the system enclosure for cooling down the processor. Alternatively, an alarm could be generated which causes the processing environment to begin a shutdown when the temperature sensors indicate that a predefined temperature level has been exceeded. The sensors are often placed at a distance from a hot spot. Unfortunately, this feedback approach may function too slowly or unreliably to prevent overheating.

Further attempts to perform heat management employ the use of software. For example, one technique slows down a component's clock so that has more time to cool down between operations. One conventional system controls the instruction fetch rate from the instruction cache to the instruction buffer using a throttling mechanism. Reducing the fetch rate lowers the generation of heat. An even more drastic approach is to shut down the processor and allow it to cool down. Unfortunately, all of these techniques directly impact the speed at which the component operates, and can be detrimental to real-time processing needs.

Therefore, there is a need in the art for new methods and apparatus for achieving thermal management while avoiding additional hardware or inefficient software routines.

SUMMARY OF THE INVENTION

In accordance with embodiments of the present invention, methods and systems are provided for performing operations are provided. In a preferred method, thermal thresholds are associated with a plurality of processing devices. Operations are provided to at least some of the processing devices. A first device can execute a first operation. If the first processing device exceeds its thermal threshold while executing the first operation, the first operation is transferred to a second processing device.

In an example, the second processing device is operable to execute a second operation. Here, the method additionally comprises transferring the second operation to the first processing device. In this case, the method preferably further comprises the first processing device executing the second operation at a reduced clock speed.

In another preferred method of performing computing operations, a plurality of processing devices are associated with a thermal threshold. Operations are provided to at least some of the processing devices. A first processing device is operable to execute a first operation. If the first processing device exceeds its thermal threshold during execution of the first operation, the first operation is transferred to a queue.

In an example, the queue is a hot queue or a cool queue. The method further includes associating a thermal attribute with the first operation, and transferring the first operation includes sending the first operation to the hot queue or the cool queue depending upon the thermal attribute. In this case, the method may include determining the thermal attribute based on an amount of heat expected to be generated by a chosen processing device if that device is selected to perform the first operation. Alternatively, the hot queue comprises a plurality of hot queues and the cool queue comprises a plurality of cool queues, each having a priority associated therewith. The first operation has an execution priority associated with it. In this case, transferring the first operation further includes sending the first operation to a selected one of the hot queues or to a selected one of the cool queues depending upon the execution priority and the priorities of the hot and cool queues.

In accordance with aspects of the invention, a preferred processing system includes first and second processors. The processors are capable of executing operations. Each processor has a thermal threshold. If the first processor exceeds its thermal threshold during execution of a first operation, the first operation is transferred to the second processor.

The processing system preferably includes a queue. If the second processor is executing a second operation while the thermal threshold of the first processor is exceeded, the second processor is operable to transfer the second operation to a queue or to the first processor. The queue may be one of a plurality of priority queues. Alternatively the queue may be a hot queue or a cool queue.

Another preferred processing system includes first and second processors. Each processor has a thermal threshold. The first and second processors are capable of executing first and second operations, respectively. The first operation has a high priority and the second operation has a low priority. If the first processor exceeds its thermal threshold during execution of the first operation, the first operation is transferred to the second processor and the second operation is transferred to the first processor. The first processor executes the second operation at a reduced clock speed.

In yet another preferred method in accordance with aspects of the present invention, a method of processing operations in a component is provided. The component executes the operations at a clock speed. The method includes providing operations having lower or higher priorities of execution. A thermal value indicative of the temperature of the component is determined. Then, depending upon the thermal value, the clock speed is lowered, and one of the operations having a lower priority of execution is selected; or the clock speed is maintained or raised, and one of the operations having a higher priority of execution is selected. Then the selected operation is processed.

In accordance with another embodiment of the present invention, a processing system is provided. The processing system is for processing operations associated with thermal attributes. The system comprises a first operation, a second operation and a processor. The first operation has a thermal attribute exceeding an operating threshold. The second operation has a thermal attribute not exceeding the operating threshold. The processor is capable of executing the operations. The processor has a thermal threshold. If the thermal threshold of the processor is not exceeded, the processor selects the first operation for processing. If the thermal threshold of the processor is exceeded, the processor selects the second operation for processing.

If the thermal threshold is not exceeded, and if the first operation is not available, the processor is preferably operable to obtain and execute the second operation. In this case, if the second operation is not available, the processor can idle for a predetermined period of time, such as one or more clock cycles. In another alternative, the system may include a plurality of priority queues. Each priority queue includes a first queue for storing the first operation and a second queue for storing the second operation. Desirably, a first one of the priority queues is a high priority queue, a second one of the priority queues is a medium priority queue, and a third one of priority queues is a low priority queue.

In accordance with aspects of the present invention, a processing apparatus for processing operations is provided. The processing apparatus comprises a memory and a plurality of processing devices. The memory stores a first operation. The processing devices are capable of executing the first operation. A first one of the processing devices may comprise a processing element, a processing unit or a sub-processing unit. The first processing device has a thermal threshold and access to the memory. If the thermal threshold is exceeded during execution of the first operation, that operation is transferred to a second processing device.

At least some of the processing devices may be processing elements. In this case, some of the processing elements may further comprise at least one sub-processing unit. Here, each sub-processing unit may include a floating point unit, an integer unit, and a register that is associated with the floating point unit and the integer unit. The sub-processing units may optionally each include a local store.

Alternatively, at least some of the processing elements may further comprise a processing unit and a plurality of sub-processing units associated with the processing unit. In this case, each sub-processing unit may further include a local store.

In an example, the first processing device includes the sub-processing unit, and the memory comprises a local store in the sub-processing unit. Preferably, the local store includes a queue for managing the operations. If the second processing device is executing a second operation while the thermal threshold of the first processing device is exceeded, the second processing device is operable to transfer the second operation to the queue or to the first processing device. The queue may be one of a plurality of priority queues. Alternatively, the queue may comprise a first queue for managing the first operation and a second queue for managing the second operation.

In another example, the memory may comprise a first memory for storing the first operation and a second memory for storing the second operation. In this case, at least some of the processing devices have access to the first and second memories. If the second processing device is executing the second operation while the thermal threshold of the first processing device is exceeded, the second processing device may transfer the second operation to the second memory or to the first processing device.

In further examples, the first operation and a second operation may be maintained in the memory at the same time, or in a timesharing arrangement.

In accordance with further aspects of the present invention, a processing apparatus is provided for processing operations. First and second memories store first and second operations. A plurality of processing devices is operable to execute the first and second operations. A first processing device may comprise a processing element, a processing unit or a sub-processing unit. The first processing unit has a thermal threshold, as well as access to the first and second memories. If the thermal threshold is exceeded during execution of the first operation, the first operation is transferred to a second processing device.

In accordance with additional aspects of the present invention, a processing apparatus is provided for processing operations. Processing devices are operable to execute operations. First and second processing devices each may comprise a processing element, a processing unit or a sub-processing unit. The first and second processing devices each have a thermal threshold. A first operation has a first priority and a second operation has a second priority. If the thermal threshold of the first processing device is exceeded during execution of the first operation, that operation is transferred to the second processing device. The second operation is transferred to the first processing device. The first processing device executes the second operation at a reduced clock speed. Preferably, the first priority is a high priority and the second priority is a low priority.

In accordance with further aspects of the present invention, a processing apparatus is provided for processing operations. A first operation has a thermal attribute that does not meet a condition. A second operation has a thermal attribute that does meet the condition. A processor is capable of executing both operations. The processor may comprise a processing element, a processing unit or a sub-processing unit. If the thermal threshold of the processor is not exceeded, the processor selects the first operation for processing. If the thermal threshold is exceeded, the processor selects the second operation for processing.

If the thermal threshold is not exceeded, and if the first operation is not available, then the processor is operable to obtain and execute the second operation. If the second operation is not available, the processor is capable of idling for a predetermined period of time.

The apparatus optionally includes a plurality of priority queues. Each priority queue includes a first queue and a second queue. The first queue is for storing the first operation and the second queue is for storing the second operation. Preferably, a first one of the priority queues is a high priority queue, a second one of the priority queues is a medium priority queue, and a third one of the priority queues is a low priority queue.

In an example, the processor comprises the sub-processing unit, which includes a floating point unit, an integer unit, and a register that is associated with the floating point unit and the integer unit. Preferably, the sub-processing unit also includes a local store.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates components grouped in various combinations in accordance with aspects of the present invention.

FIGS. 2A-B are graphical illustrations plotting temperature versus time for computing devices.

FIG. 3A is a diagram illustrating an exemplary structure of a processing element (PE) in accordance with aspects of the present invention.

FIG. 3B is a diagram illustrating an exemplary structure of a multiprocessing system of PEs in accordance with aspects of the present invention.

FIG. 4 is a diagram illustrating an exemplary structure of a sub-processing unit (SPU) in accordance with aspects of the present invention.

FIG. 5 is a diagram illustrating multi-queue scheduling in accordance with aspects of the present invention.

FIG. 6 is a flow diagram illustrating an exemplary dynamic scheduling process according to aspects of the present invention.

FIG. 7 is a diagram illustrating multi-queue scheduling in accordance with aspects of the present invention.

FIG. 8 is a flow diagram illustrating an exemplary dynamic scheduling process according to aspects of the present invention.

FIGS. 9A-C are diagrams illustrating task migration according to aspects of the present invention.

FIGS. 10A-B illustrate components and thermal values associated with the components according to aspects of the present invention.

FIG. 11 illustrates compiler functionality in accordance with aspects of the present invention.

DETAILED DESCRIPTION

In describing the preferred embodiments of the invention illustrated in the drawings, specific terminology will be used for the sake of clarity. However, the invention is not intended to be limited to the specific terms so selected, and it is to be understood that each specific term includes all technical equivalents that operate in a similar manner to accomplish a similar purpose.

Reference is now made to FIG. 3A, which is a block diagram of a basic processing module or processor element (PE) 300 that can be employed in accordance with aspects of the present invention. As shown in this figure, the PE 300 preferably comprises an I/O interface 302, a processing unit (PU) 304, a direct memory access controller (DMAC) 306, and a plurality of sub-processing units (SPUs) 308, namely SPUs 308 a-308 d. While four SPUs 308 a-d are shown, the PE 300 may include any number of such devices. A local (or internal) PE bus 320 transmits data and applications among PU 304, the SPUs 308, I/O interface 302, DMAC 306 and a memory interface 310. Local PE bus 320 can have, e.g., a conventional architecture or can be implemented as a packet switch network. Implementation as a packet switch network, while requiring more hardware, increases available bandwidth.

PE 300 can be constructed using various methods for implementing digital logic. PE 300 preferably is constructed, however, as a single integrated circuit employing CMOS on a silicon substrate. PE 300 is closely associated with a memory 330 through a high bandwidth memory connection 322. The memory 330 desirably functions as the main memory for PE 300. Although the memory 330 is preferably a dynamic random access memory (DRAM), the memory 330 could be implemented using other means, e.g., as a static random access memory (SRAM), a magnetic random access memory (MRAM), an optical memory, a holographic memory, etc. DMAC 306 and memory interface 310 facilitate the transfer of data between the memory 330 and the SPUs 308 and PU 304 of the PE 300.

PU 304 can be, e.g., a standard processor capable of stand-alone processing of data and applications. In operation, the PU 304 schedules and orchestrates the processing of data and applications by the SPUs 308. The SPUs 308 preferably are single instruction, multiple data (SIMD) processors. Under the control of PU 304, the SPUs 308 may perform the processing of the data and applications in a parallel and independent manner. DMAC 306 controls accesses by PU 304 and the SPUs 308 to the data and applications stored in the shared memory 330. Preferably, a number of PEs, such as PE 300, may be joined or packed together, or otherwise logically associated with one another, to provide enhanced processing power.

FIG. 3B illustrates a processing architecture comprised of multiple PEs 350 (PE 1, PE 2, PE 3, and PE 4) that can be operated in accordance with aspects of the present invention. Preferably, the PEs 350 are on a single chip. The PEs 350 may or may not include the subsystems such as the PU and/or SPUs discussed above with regard to the PE 300 of FIG. 3A. The PEs 350 may be of the same or different types, depending upon the types of processing required. For example, the PEs 350 may be generic microprocessors, digital signal processors, graphics processors, etc.

The PEs 350 are preferably tied to a shared bus 352. A memory controller or DMAC 356 may be connected to the shared bus 352 through a memory bus 354. The DMAC 356 connects to a memory 358, which may be of one of the types discussed above with regard to memory 330. An I/O controller 362 may also be connected to the shared bus 352 through an I/O bus 360. The I/O controller 362 may connect to one or more I/O devices 364, such as frame buffers, disk drives, etc. It should be understood that the above processing modules and architectures are merely exemplary, and the various aspects of the present invention may be employed with other structures, including, but not limited to multiprocessor systems of the types disclosed in U.S. Pat. No. 6,526,491, entitled “Memory Protection System and Method for Computer Architecture for Broadband Networks,” issued on Feb. 25, 2003, and U.S. application Ser. No. 09/816,004, entitled “Computer Architecture and Software Cells for Broadband Networks,” filed on Mar. 22, 2001, which are hereby expressly incorporated by reference herein.

FIG. 4 illustrates the structure and function of an SPU 400 that can be employed in accordance with aspects of the present invention. SPU 400 preferably includes local store 402, registers 404, one or more floating point units 406 and one or more integer units 408. The components of SPU 400 are, in turn, comprised of subcomponents, as will be described below. Depending upon the processing power required, a greater or lesser number of floating point units (FPUs) 406 and integer units (IUs) 408 may be employed. In a preferred embodiment, local store 402 contains at least 128 kilobytes of storage, and the capacity of registers 404 is 128×128 bits. Floating point units 406 preferably operate at a speed of at least 32 billion floating point operations per second (32 GFLOPS), and integer units 408 preferably operate at a speed of at least 32 billion operations per second (32 GOPS).

Local store 402 is preferably not a cache memory. Cache coherency support for the SPU 400 is unnecessary. Instead, the local store 402 is preferably constructed as an SRAM. A PU 204 may require cache coherency support for direct memory access initiated by the PU 204. Cache coherency support is not required, however, for direct memory access initiated by the SPU 400 or for accesses to and from external devices.

SPU 400 further includes bus 410 for transmitting applications and data to and from the SPU 400 through a bus interface (Bus I/F) 412. In a preferred embodiment, bus 410 is 1,024 bits wide. SPU 400 further includes internal busses 414, 416 and 418. In a preferred embodiment, bus 414 has a width of 256 bits and provides communication between local store 402 and registers 404. Busses 416 and 418 provide communications between, respectively, registers 404 and floating point units 406, and registers 404 and integer units 408. In a preferred embodiment, the width of busses 416 and 418 from registers 404 to the floating point or integer units is 384 bits, and the width of the busses 416 and 418 from the floating point or integer units to the registers 404 is 128 bits. The larger width of the busses from the registers 404 to the floating point units 406 and the integer units 408 accommodates the larger data flow from the registers 404 during processing. In one example, a maximum of three words are needed for each calculation. The result of each calculation, however, is normally only one word.

Reference is now made to FIG. 1, which illustrates components 102 formed on or in a substrate 100. The substrate 100 and the components 102 may comprise part or all of a computer chip. The components 102 may be logic devices or other circuitry. One or more components 102 in an area of the substrate 100 may be associated together as a unit 104. Units 104 and groups 106 of units 104 may also be associated with one another to form, e.g., PEs 300, PUs 304, SPUs 308, PEs 350 or subcomponents thereof. For example, a group of units 106 may comprise an SPU 400 and units 104 within the group 106 may comprise local store 402, registers 404, FPU 406, Integer Unit 408 and Bus I/F 412. Each unit 104, in turn, may include other units 104 and components 102 as well, such as DRAM memory cells, logic gates, buffers, etc. While components 102, units 104 and groups 106 have been used to illustrate various levels of complexity, the term “component” is also used more generally to refer to devices at all levels, from the most basic building blocks (e.g., transistor and capacitors) up to the PE 300 or the PE 350 and the entire computer chip itself. Typically, the components are constructed as integrated circuits employing a complementary metal oxide semiconductor (CMOS) on the substrate 100. The substrate 100 is preferably a silicon substrate. Alternative materials for the substrate 100 include, but are not limited to, gallium arsenide, gallium aluminum arsenide and other so-called III-B compounds employing a wide variety of dopants. Components 102 could also be implemented using superconducting material, e.g., rapid single-flux-quantum (RSFQ) logic.

As the components perform operations such as processing instructions or tasks (e.g., a series of instructions), they often generate heat. As used herein, the terms “operation” or “tasks” relate to activities to be performed, and include, but are not limited to, instructions, tasks and programs of single or multiple steps.

In one aspect of the invention, operations to be performed by a component may be associated with a thermal attribute such that the thermal attribute's value is related to the amount of heat that is expected to be generated by that component when it performs that operation. Preferably, the thermal attribute is also based in time. For example, the value of the attribute may represent the amount of heat generated over a fixed period of time.

The thermal attribute may be either measured or estimated. For example, a thermometer or other temperature sensing device may be used to actually measure the temperature of the unit as it performs a particular operation.

The thermal attribute is preferably estimated based on the power consumption of the components. For example, some components may require more power to operate and have a higher thermal attribute. Other components may have the same power consumption but are more densely packed together, which would tend to generate more heat than components that are spaced well apart. In this regard, the thermal attribute may be estimated based on both factors, in which case the thermal attribute is based on the power density of the component or groups of components. Thus, in some cases, the thermal attribute may reflect the heat expected to be generated as the component executes an operation, the amount of heat generated over a period of time, the general power consumption of a component, the power density of a component, and the power density of related (e.g., physically or logically related) groups of components. In order to achieve effective thermal management of the chip, it may be desirable to schedule power consumption for each component. Component power consumption may be estimated during chip development. For example, circuit simulation of the chip, subsystems and/or individual components may be performed.

Preferably, the thermal attributes are further associated with specific components. For example, if an operation—such as an integer add operation—involves only integer unit 408, then the thermal attribute can be specifically associated with integer unit 408. Similarly, the thermal attribute of a floating point operation may be specifically associated with floating point unit 406. Other operations may involve a set of components, such as moving data from local store 402 to register 404. Still other operations may involve all of the components or may be difficult to attribute to any one particular set of components. For example, rendering a 3-D figure may involve all of the components in SPU 400, in which case the thermal attribute is applied to all of the components in SPU 400. Alternatively, it may be difficult to predict how much heat will be generated by individual components when performing an operation, in which case a thermal attribute for the operation can be generally assigned to a group of components. The table below illustrates a sample set of operations, components and thermal attributes.

Thermal Operation Attribute Component(s) 3-D Rendering 12 SPU 400 Integer Add 3 IU 408 Floating Point Add 7 FPU 406 Memory Move 2 Store 402, Registers 404

In a preferred example, the thermal attribute for a given component (or set of components) may be calculated as follows: TA=k*(P/S) TA, the thermal attribute, is equal to the power density, or power consumption (P) of a component, divided by the size or footprint (S) of the component, multiplied by a factor or constant (k) that is used for thermal estimation.

In accordance with one aspect of the invention, a program compiler uses the thermal attributes to help prevent a component from overheating. The compiler may be implemented in software, firmware, hardware or a combination of the above. It may be associated with (e.g., incorporated into) a processing element (such as PE 300 or PE 350) or subcomponent thereof. FIG. 11 illustrates compiler functionality in accordance with aspects of the invention. As is well known in the art, compilers receive source code and generate object code that can be run on a computing system. According to aspects of the present invention, the compiler receives source code as well as thermal attributes relating to operations and/or components. The compiler preferably generates object code based on the thermal attributes. As the compiler manages compilation by counting the number of instructions, the thermal attribute(s) of the object code compiled by the compiler is statically estimated. Enhanced thermal attribute determination is preferably made using a “profiler,” which is a performance monitor that can count dynamic execution of the instructions and can report the operating frequency of each component. The profiler can provide more accurate thermal estimates to the compiler, which, in turn, will result in thermally optimized object code generation.

FIGS. 2A-B illustrate how a compiler or other instruction scheduler can manage operations so as to avoid degradation of the processing or damage to the components. For the purpose of illustration, it shall be assumed that the thermal threshold (T_(max)) represents a temperature which is undesirable to exceed. The triangular segments A, B and C represent instructions which are performed by a component. For instance, segments A and B represent, e.g., computationally intensive instructions or tasks that generate a significant amount of heat while segment C is, e.g., not as computationally intensive and does not generate as much heat as either A or B. More specifically, assume that tasks A, B and C are parts of the overall calculation (2*3)+(4*5)+(6+7), wherein task A represents (2*3), task B represents (4*5) and task C represents (6+7). As seen in FIG. 2A, when the tasks are performed in the order of A, B and C, the temperature can exceed T_(max). Here, because A and B are performed consecutively, the thermal threshold T_(max) is breached.

It is well known in the art that a compiler often has discretion with respect to how it orders certain instructions. In accordance with a preferred embodiment of the present invention, the compiler may selectively reorder the schedule based on the thermal attributes of the operations. Preferably, the compiler initially determines whether any of the operations A, B or C has a thermal attribute associated with it. If so, the compiler may selectively compile the operations into object code using an order that prevents T_(max) from being exceeded. In the above example, the compiler may change the order in which the equation is calculated without changing the ultimate result. For example, it may schedule the operations in the order of A, C and B. Thus, as seen by FIG. 2B, when the order of the instructions is changed, the temperature does not exceed T_(max).

Note that the thermal threshold T_(max) is not necessarily a failure temperature. Instead, T_(max) may be a design criteria selected, e.g., based on rated operating parameters.

Furthermore, when reordering operations, the compiler preferably keeps track of the components which do the computations. For example, a series of operations may cause one part of SPU 400 to overheat (such as FPU 406) while the other parts of the SPU stays cool (such as FPU 408). The compiler preferably addresses this problem by attempting to schedule operations so that they are evenly distributed among the various components of the SPU. One manner in which the compiler may do this is to track or simulate the temperature of the components as they perform the program's operations by using the thermal attributes. For example, component X may be assumed to cool at the rate of 2 thermal attribute points per clock cycle and have a threshold of 8 thermal attribute points before it overheats. If an operation associated with that component has a thermal attribute of 5 points per cycle, then the component would be assumed to overheat if that operation was performed three times in a row (5-2 points after first cycle results in current thermal index of 3; 5-2 points after second cycle adds another 3 points for a total current thermal index of 6; 5-2 points after second cycle adds another 3 points for a total current thermal index of 9). Having detected that component X may overheat with such scheduling, the compiler would attempt to schedule an operation to be performed by another component while component X remains inactive and cools down.

Alternatively, the compiler may attempt to select a different operation whose thermal attribute is lower than the rate at which the component is expected to cool down. For example, if the compiler determines that component X may overheat with the current schedule of operations, it may attempt to intersperse an operation having a thermal attribute of 1 (which would allow the component to cool somewhat given that it cools at the rate of 2 thermal attributes a cycle) in between the operations having a thermal attribute of 5.

To the extent components are contained by other components, the compiler may further allocate the thermal attribute of a larger component to its subcomponents, or from a subcomponent to its parent component. For example, as shown in FIG. 10A, if the individual components are simultaneously performing operations having thermal attributes of 2, 3, 2, and 7, the thermal attribute for the SPU for all of those operations may be considered to be 14. On the other hand, a thermal attribute that is attributable to an entire SPU 400 may be allocated to individual components. As shown in FIG. 10B, if the thermal attribute of 3-D rendering is 12 and attributable to the entire SPU, that value may be evenly allocated to components within the SPU 400. Other variations in allocation are possible, including allocations between and among components that are related by a container relationship, logical functions and physical proximity.

It can be seen that the heat values of various components reflect not only the instant operations of individual components, but may also be cumulative over time and may be aggregated for sets of components. Taking these factors into account, the compiler can effectively schedule operations to avoid the thermal threshold T_(max).

Preferably, a cooling attribute is associated with the computer chip containing the various components. The cooling attribute depends on the specific features of the cooling system of the computer chip. For example, the cooling attribute preferably depends on the chip packaging and cooler (such as a heat sink or a fan), if any. If the cooling system has only one state for the cooler (e.g., always operating the fan at a set rotation speed), the cooling attribute will be fixed. If the state of the cooling system can be altered, such as by changing the rotation speed of the fan, the cooling attribute is preferably dynamic, and may be determined or updated when the cooling system changes the operating state of the cooler. In one embodiment, the compiler uses a fixed cooling attribute calculated based upon a typical operational state of the cooler. The compiler uses the cooling attribute when calculating the density of operations belonging to specific components. More preferably, the compiler also factors in the heat dissipation capabilities of the chip packaging. In a further embodiment, the compiler or the profiler employs a dynamic cooling attribute to help the compiler perform object code generation. The table below illustrates an exemplary schedule for an integer operation that will be processed by a given integer unit (IU) 408 and a given local store (LS) 402 based upon thermal and cooling attributes.

Instruction # Instruction Processed By IU LS 1 LS 0 2 2 IU 3 1 3 LS 2 3 4 IU 5 2 5 nop 4 1 6 IU 7 0 7 IU 10  0 8 Other 9 0 9 nop 8 0 10  nop 7 0 . . . . . . . . . . . .

For the above set of instructions, assume that the thermal attribute of the IU 408 is 3, the cooling attribute of the chip is 1, and the thermal threshold of the IU 408 is 10. The leftmost column identifies the instruction number, the second column identifies which component handles that instruction, and the two columns on the right of the table show the heat generated or the temperature of the component after handling the instruction. For example, instruction 1 is processed or implemented by the LS, resulting in a heat value of 2, while the IU remains at zero. Instruction 2 is operated on by the IU, after which the IU has a heat value of 3, and the LS has cooled off to a heat value of 1. The processing continues until instruction 5, which is a “no operation” (nop). This permits the IU and LS to cool off to some degree. The IU processes instructions 6 and 7, raising its heat value to the threshold. In order to prevent exceeding the threshold, a different component (“Other”) preferably processes the next instruction. For example, the profiler may monitor the execution of the instructions by the IU and LS and report the information to the compiler. The compiler may use this information in conjunction with the thermal attributes and cooling attribute to have instruction 8 processed by another IU.

Reference is now made to FIG. 5, which illustrates a multi-queue scheduling methodology 500 in accordance with aspects of the present invention. As seen in FIG. 5, a scheduler 502 is preferably associated with two queues. For convenience, the first queue is referred to herein as a “hot queue” 504 and the second queue is referred to herein as a “cool queue” 506. The queues 504, 506 may be implemented in many different ways, e.g., as data structures or a continuous or discontinuous collection in memory. In one example employing the SPUs 400, the queues 504, 506 are implemented external to the SPUs 400. The queues 504, 506 may also be implemented external to the PU 304 or the PE 300 (or PE 350), e.g., associated with the memory 330 (or memory 358). In another example, the queues 504, 506 are implemented internal to the SPUs 400. Desirably, the queues 504, 506 may be implemented in association with the local store 402 or the registers 404. For example, the hot queue 504 may be implemented in conjunction with the local store 402 of a first SPU 400 and the cool queue 506 may be implemented in conjunction with the local store 402 of a second SPU 400. In the case where an SPU 400 includes multiple local stores 402, the hot queue 504 may be stored in a first one of the local stores 402 while the cool queue 506 may be stored in a second one of the local stores 402 in the same SPU 400. Alternatively, both the hot queue 504 and the cool queue 506 may be implemented in the same local store 402 or in the same memory external to the SPU 400 or external to the PE 300. If the queues 504, 506 are implemented via the registers 404, various alternatives are possible. In one case, the hot queue 504 may be implemented via the register 404 of a first SPU 400 and the cool queue 506 may be implemented via the register 404 of a second SPU 400. The queues 504, 506 may also be implemented in a timesharing arrangement, for example where one of the queues 504, 506 is stored in a memory for a first period of time and then the other one of the queues 504, 506 is stored in the memory for a second period of time.

The scheduler 502 may populate the hot queue 504 and cool queue 506 with instructions, tasks or other operations, depending upon thermal attributes. Preferably, the scheduler 502 has access to a look-up table containing thermal attributes. The scheduler 502 may operate before and/or during runtime operation. The scheduler 502 may choose a task from the hot queue 504 or the cool queue 506 depending upon the current (or predicted) temperature of a component. In a preferred example, so long as the current temperature of the device does not exceed an operating threshold, the scheduler 502 may select any task from either the hot or cool queues 504, 506. In another preferred example, if the operating threshold is not exceeded and if both hot and cool tasks are available, the scheduler 502 selects tasks from the hot queue 504 before selecting tasks from the cool queue 506. By way of example only, floating point instructions or tasks requiring multiple operations may be associated with a relatively high or positive thermal attribute value. These operations would be placed in the hot queue 504, e.g., as seen by tasks H₁ . . . H_(N). Other operations, such as integer instructions and single operation tasks, may be associated with a relatively low or negative thermal attribute. Such operations would be placed in the cool queue 506, e.g., as seen by tasks C₁ . . . C_(N). The thermal attribute of a task is preferably determined using information from the compiler and/or profiler, either of which may report the operating frequency of each component performing the task. More preferably, the thermal attribute of the task incorporates the operating frequency (e.g., the frequency of use) of the component(s), the thermal attribute of the component(s), and the cooling attribute. In accordance with one embodiment, a simple scheduler only uses the total thermal attribute of a component that has sub-components, such as the SPU 400. In accordance with another embodiment, an advanced scheduler manages the thermal attributes of sub-components of the SPU such as the LS 402, the FPU 406 and the IU 408. The table below illustrates thermal attributes for an IU, an FPU and an LS in a given SPU for a 3-D task and an MPEG-2 task.

Task IU FPU LS Total (SPU) 3-D 3 7 2 12 MPEG-2 2 0 0  2

A simple scheduler that only looks at the total thermal attribute for the SPU will see that it has a value of 12, which may exceed the thermal threshold of the SPU. Thus, the simple scheduler may only select the MPEG-2 task for execution by the SPU. In contrast, an advanced scheduler preferably monitors the sub-components of the SPU. In this case, the advanced scheduler may see that no sub-component exceeds its thermal threshold, so the 3-D task may be selected. In an alternative, the schedule may reorder the tasks or the operations within the tasks so that the MPEG-2 task is performed at a certain stage, giving the FPU time to cool off. This flexibility is a powerful tool that enables sub-components, components and/or the entire multiprocessing system to operate without overheating.

As will be apparent to one skilled in the art, the scheduler 502 may be implemented in hardware, firmware, or software. Preferably, the scheduler 502 is hardware-based and implemented in the PU 204. In another preferred alternative, the scheduler 502 is software-based as part of the operations system of the overall computing device. The hot queue 504 and the cool queue 506 are preferably accessible to one or more PEs (PE₁ . . . PE_(N)), PUs (PU₁ . . . PU_(N)), and/or SPUs (SPU₁ . . . SPU_(N)) during a program execution through a bus 508. In accordance with one embodiment, each PE, PU and/or SPU preferably includes thermal sensors (temperature sensing means) to monitor their temperature or, alternatively, estimate the current temperature. In accordance with another embodiment, each PE preferably includes a thermal sensor and an analog to digital A/D converter in order to provide a digital estimation of the temperature. Each kernel on the PE can preferably read its own digitized temperature at any time. The PEs, PUs and SPUs desirably each have a thermal threshold T_(max), which can differ from component to component. If thermal sensors are not available, the current temperature may be calculated by the thermal attribute of the task and the current cooling attribute.

The scheduler 502 may also manage operations without using queues. The operations may be stored in memory and the scheduler 502 may assign some of the operations to processors depending upon the thermal attributes. For example, if there are two operations, the scheduler can assign the two operations to two separate processing elements 300 (or other processing devices) based on the thermal attributes. The operations may be stored in separate memories (or in separate portions of a single memory). The first operation may be stored in a first memory (or first portion of a single memory) and the second operation may be stored in a second memory (or second portion of the single memory). It is not necessary to store the two operations simultaneously; rather, they may be stored in the same or different memory during different time periods (and alternate during fixed or variable continuous or discontinuous periods). Furthermore, it should be understood that the two memories (or two portions of a single memory) are not necessarily dedicated memories limited to specific operations or operations associated with specific thermal attributes. Thus, the first memory (or first portion of the single memory) may store the second operation and the second memory (or second portion of the single memory) may store the first operation. Likewise, it should be understood that the first and second queues 504, 506 may operate in a similar fashion.

FIG. 6 illustrates a flow diagram 600 of a preferred method for obtaining and processing operations. At step 602, the PE, PU or SPU determines whether its current temperature is above the thermal threshold T_(max). If T_(max) is not exceeded, the process next advances to step 604, otherwise the process proceeds to step 608. In step 604, it is determined whether an operation is available from the hot queue 504. If an operation is available, the process advances to step 606, otherwise the process advances to step 608. In step 606, the PE, PU or SPU obtains a “hot” operation and executes it. Upon completion of the operation, the process returns to step 602. In step 608, it is determined whether an operation is available from the cool queue 506. If an operation is available, the process advances to step 610. Otherwise, the process proceeds to step 612. In step 610, the PE, PU or SPU obtains a “cool” operation and executes it. Upon completion of the operation, the process returns to step 602. If no tasks are available for processing, the process may idle or perform a “nop” at step 612 for a period of time (e.g., a predetermined number of cycles) before returning to step 602. Optionally, as discussed above with regard to FIG. 5, if both hot and cool tasks are available and T_(max) is not exceeded, either a hot or a cool task may be selected. Thus, as seen by flow diagram 600, processing devices are able to avoid hot spots and overheating by selecting tasks from the hot and cool queues 504, 506. This process may be performed concurrently by one or more processing devices, thereby permitting execution of instructions and tasks without altering clock speed or shutting down the processing devices.

It is possible to combine the use of hot and cool queues with priority queues, as seen in FIG. 7. In this figure, a multi-queue scheduling methodology 540 is provided. A scheduler 542 is associated with three priority queues, high priority queue 544, medium priority queue 546 and low priority queue 548, although different priority levels and numbers of queues may be employed. The scheduler 542 operates as described above with reference to the scheduler 502. Each of the priority queues 544, 546 and 548 preferably includes a hot queue and a cool queue, which are created and operate in the same manner described above with regard to FIG. 5. For example, the high priority queue 544 has a hot queue for handling tasks H_(1H) . . . H_(NH) and a cool queue for handling tasks C_(1H) . . . C_(NH). Similarly, the medium priority queue has a hot queue for handling tasks H_(1M) . . . H_(NM) and a cool queue for handling tasks C_(1M) . . . C_(NM). The low priority queue has a hot queue for handling tasks H_(1L) . . . H_(NL) and a cool queue for handling tasks C_(1L) . . . C_(NL).

FIG. 8 illustrates a flow diagram 800 of a preferred method for obtaining and processing operations when employing priority queues. Initially, in step 801, the PE, PU or SPU determines what priority queue to employ, e.g., high priority queue 544, medium priority queue 546 or low priority queue 548. At step 802, the PE, PU or SPU determines whether its current temperature is above thermal threshold T_(max). If T_(max) is not exceeded, the process next advances to step 804, otherwise the process proceeds to step 808. In step 804, it is determined whether an operation is available from the hot queue 504 of the selected priority queue. If an operation is available, the process advances to step 806, otherwise the process proceeds to step 808. In step 806, the PE, PU or SPU obtains a “hot” operation and executes it. Upon completion of the operation, the process returns to step 801. In step 808, it is determined whether an operation is available from the cool queue 506 of the selected priority queue. If an operation is available, the process advances to step 810, otherwise the process proceeds to step 812. In step 810, the PE, PU or SPU obtains a “cool” operation and executes it. Upon completion of the operation, the process returns to step 801. If no tasks are available for processing, the process idles at step 812 before returning to step 801. Optionally, if both hot and cool tasks are available for a given priority level and T_(max) is not exceeded, either a hot or a cool task may be selected for that priority level. Thus, as seen by the flow diagram 800, processing components are able to avoid hot spots and overheating by selecting tasks during runtime from the hot and cool queues of the various priority queues 544, 546 and 548. This process may be performed concurrently by one or more processing components, thereby permitting execution of instructions and tasks without altering clock speed or shutting down the processing components. In an alternative, if the processing device gets too hot and nears or exceeds T_(max), it can select operations from a lower priority queue (e.g., medium priority queue 546 or low priority queue 548) and/or execute operations at a reduced clock cycle notwithstanding the operations' thermal attributes. Such lower priority tasks may be performed at a reduced clock cycle.

In some situations, a component may be below the thermal threshold T_(max) prior to executing an operation (e.g., a task), but may then exceed T_(max) during task execution. In the past, such an occurrence would likely necessitate shutting down the component and allowing it to cool off. However, a technique has been developed which addresses this problem, and which is particularly suitable for multiprocessor environments.

FIG. 9A illustrates multiple PEs running a group of tasks. In this example, assume PE 2 overheats during its processing of task 1. It is possible to move task 1 from PE 2 to one of the other processors, which may be operating other tasks, e.g., tasks 2 and 3. The other tasks are preferably lower priority tasks then the one currently being performed by PE 2.

As seen in FIG. 9B, the task in the other processor, e.g., task 3, may be “swapped out” and sent to, e.g., the appropriate queue (or to a different processor). Thus, PE 2 would not perform a task while PE 3 completes task 1. Alternatively, the two processors can swap tasks so that PE 2 performs the lower priority task as seen in FIG. 9C. As seen in FIG. 9C, (1) initially PE 2 and PE 3 may operate at standard clock speed of, e.g., 500 MHz. Then, (2) if PE 2 becomes hot while operating a high priority task 1, its task may be switched with lower priority task 3 of PE 3. Finally, (3) the lower priority task 3 may be performed at a slower or reduced clock speed (e.g., 250 MHz), allowing PE 2 to cool off, while PE 3 continues execution of task 1 at the standard clock speed of 500 MHz. It is also possible to increase the clock speed (e.g., to 650 MHz) to perform a higher priority task. It should be understood that the standard, increased and reduced clock speeds are merely exemplary, and may vary depending upon the specific architecture of the processor, sub-processor and/or maximum clock rate of the multiprocessing system. In a worst-case scenario, the overheating processor may halt operations until the temperature reaches a satisfactory level. However, the other processors in the multiprocessor system will continue processing so that real time operations and other critical operations are performed promptly. While PEs are shown in FIGS. 9A-C, it is possible to perform the same operations with PUs and SPUs, or combinations of various processing devices. For example, an overheating SPU 308 may send its high priority task to the PU 304, which can reassign the task to a second SPU 308. Similarly, the PU 304 may take the lower priority task of the second SPU 308 and assign it to the first SPU 308. Once the first SPU 308 cools down, it may resume processing high priority and/or “hot” tasks at the normal clock speed.

Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. 

1. A processing system for processing operations associated with thermal attributes, comprising: a first operation having a first thermal attribute exceeding an operating threshold; a second operation having a second thermal attribute not exceeding the operating threshold, the first and second thermal attributes (TA) being determined according to the equation: TA=k*(P/S) in which P is power density of a component, S is the footprint of the component, and k is a thermal estimation constant; and a processor for executing the first and second operations, the processor having a thermal threshold; wherein, if the thermal threshold of the processor is not exceeded, the processor selects the first operation for processing, and if the thermal threshold of the processor is exceeded, the processor selects the second operation for processing.
 2. The system of claim 1, wherein, if the thermal threshold is not exceeded, and if the first operation is not available, then the processor is operable to obtain and execute the second operation.
 3. The system of claim 2, wherein, if the second operation is not available, then the processor is operable to idle for a predetermined period of time.
 4. The system of claim 1, further comprising: a plurality of priority queues, each of the priority queues including a first queue and a second queue, the first queues for storing the first operation and the second queues for storing the second operation.
 5. The system of claim 4, wherein a first one of the priority queues is a high priority queue, a second one of the priority queues is a medium priority queue, and a third one of the priority queues is a low priority queue.
 6. The system of claim 1, wherein the power density of the component is based on a power density of the processor.
 7. The system of claim 6, wherein the processor includes a plurality of subcomponents, and the power density is based on a physically related group of the subcomponents.
 8. The system of claim 6, wherein the processor includes a plurality of subcomponents, and the power density is based on a logically related group of the subcomponents.
 9. The system of claim 1, wherein the first and second thermal attributes are further based on an amount of heat generated over a period of time by the processor.
 10. The system of claim 1, further comprising a compiler configured to manage component temperature, wherein: the first and second thermal attributes each have one or more points associated therewith; the component has a thermal index associated therewith, the thermal index identifying a number of thermal attribute points that the component dissipates as heat per clock cycle; and the compiler is operable to predetermine whether the component will overheat when executing at least one of the first and second operations based on the number of thermal attribute points dissipatable per clock cycle in comparison to the thermal attribute points of the at least one first and second operations.
 11. A processing apparatus for processing operations, comprising: a first operation having a first thermal attribute not meeting a condition; a second operation having a second thermal attribute meeting the condition, the first and second thermal attributes (TA) being determined according to the equation: TA=k*(P/S) in which P is power density of a component, S is the footprint of the component, and k is a thermal estimation constant; and a processor for executing the first and second operations, the processor comprising a processing element, a processing unit or a sub-processing unit and having a thermal threshold; wherein, if the thermal threshold of the processor is not exceeded, the processor selects the first operation for processing, and if the thermal threshold of the processor is exceeded, the processor selects the second operation for processing.
 12. The processing apparatus of claim 11, wherein, if the thermal threshold is not exceeded, and if the first operation is not available, then the processor is operable to obtain and execute the second operation.
 13. The processing apparatus of claim 12, wherein, if the second operation is not available, then the processor is operable to idle for a predetermined period of time.
 14. The processing apparatus of claim 11, further comprising a plurality of priority queues, each of the priority queues including a first queue and a second queue, the first queues for storing the first operation and the second queues for storing the second operation.
 15. The processing apparatus of claim 14, wherein a first one of the priority queues is a high priority queue, a second one of the priority queues is a medium priority queue, and a third one of the priority queues is a low priority queue.
 16. The processing apparatus of claim 11, wherein the processor comprises the sub-processing unit, and the sub-processing unit includes a floating point unit, an integer unit and a register associated with the floating point unit and the integer unit.
 17. The processing apparatus of claim 16, wherein the sub-processing unit further includes a local store.
 18. The processing apparatus of claim 16, wherein the power density of the component is based on a physically related group of one or more of the floating point unit, the integer unit and the register of the processor.
 19. The processing apparatus of claim 16, wherein the power density of the component is based on a logically related group of one or more of the floating point unit, the integer unit and the register of the processor.
 20. The processing apparatus of claim 11, wherein the power density of the component is based on a power density of the processor.
 21. The processing apparatus of claim 11, wherein the first and second thermal attributes are further based on an amount of heat generated over a period of time by the processor.
 22. The processing apparatus of claim 11, further comprising a compiler configured to manage component temperature, wherein: the first and second thermal attributes each have one or more points associated therewith; the component has a thermal index associated therewith, the thermal index identifying a number of thermal attribute points that the component dissipates as heat per clock cycle; and the compiler is operable to predetermine whether the component will overheat when executing at least one of the first and second operations based on the number of thermal attribute points dissipatable per clock cycle in comparison to the thermal attribute points of the at least one first and second operations. 